Ridged integrated heat spreader

ABSTRACT

An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package level heat dissipation device, such as an integrated heat spreader, attached to the package substrate encapsulating the integrated circuit die. The package level heat dissipation device has a top side with a ridge formed on top of a perimeter of the top side, and a bottom side that couples to the integrated circuit die.

This is a Divisional Application of application Ser. No. 13/997,149filed Jun. 21, 2013, which is a U.S. National Phase Application under 35U.S.C. §371 of International Application No. PCT/US2011/066584, filedDec. 21, 2011.

FIELD OF THE INVENTION

This invention relates generally to an integrated circuit package. Morespecifically, this invention relates to an integrated heat spreader.

BACKGROUNDS AND RELATED ARTS

As the density of transistors and circuits in integrated circuit devicesincreases, thermal management of the integrated circuit device at thepackage and component levels is becoming more and more critical to theperformance and longevity of the integrated circuit device. With theincreasing demand for computing power, integrated circuit devices suchas microprocessors are becoming more complex, and the number ofprocessing cores integrated into a single chip is also increasing. As aresult, integrated circuit dies such as microprocessor dies are becomingphysically larger, and consequently, integrated circuit packages arealso becoming larger, because larger package substrates are required toaccommodate the larger dies. With larger integrated circuit packages,larger package level heat dissipation devices are needed to adequatelycool the integrated circuit devices. Also, as the complexity of theintegrated circuit devices increases, the number of socket contacts alsocontinues to grow. With a greater number of socket contacts, a highersocket loading force is required to secure the integrated circuitpackage into a socket. The impact of larger packages and higher socketloads is an increase in the warpage of the package level heatdissipation device such as an integrated heat spreader (IHS).

FIG. 1 illustrates a cross section view of an integrated circuit package100 before a component level heat dissipation device, such as a heatsink, is attached to the integrated circuit package 100. In theintegrated circuit package 100, a package level heat dissipation devicesuch as an integrated heat spreader (IHS) 150 is placed above anintegrated circuit die 140 to provide a low thermal resistance pathbetween the integrated circuit die 140 and a component level heatdissipation device above the IHS 150. During operation of the integratedcircuit device, heat generated in the integrated circuit die 140 isdissipated through the IHS 150 up towards the component level heatdissipation device. To increase the thermal transfer efficiency and toprovide adhesion between the IHS 150 and the component level heatdissipation device above the IHS 150, a thermal interface material(TIM), such as a phase change material or a thermal grease material thathas a tendency to flow, is disposed on the top surface of the IHS 150before the component level heat dissipation device is attached to theintegrated circuit package 100. A layer of TIM 141 is also placedbetween the integrated circuit die 140 and the IHS 150.

FIG. 2 illustrates an integrated circuit package assembly 200 that showsthe warpage of an IHS 150 after an integrated circuit package 100 hasbeen inserted and secured in the socket 120, and after a heat sink 170has been attached to the integrated circuit package 100. In socketedapplications, an independent loading mechanism (ILM), which includes aload plate 181 and a retention frame 182, applies a downward force atthe step 154 along the edges of the IHS 150 to secure the integratedcircuit package 100 into the socket 120. Furthermore, the IHS 150 isalso subjected to additional downward loading forces around the edges ofthe IHS 150 when the heat sink 170 is secured to the integrated circuitpackage 100 with connectors 183 that are mounted from the heat sink 170onto the retention frame 182 of the ILM and/or onto the printed circuitboard (PCB) 110 at attachment points overhanging the IHS 150. As aresult of these downward forces from the ILM and the heat sink 170 beingapplied to the edges of the IHS 150, the top side of the IHS 150 can bewarped when the integrated circuit package assembly 200 is assembled,creating a convex warpage on the top side of the IHS 150 as shown. Thewarpage, which is defined as the difference in height at the highestpoint 180A and the lowest point 180B on the top side of the IHS 150, canbe over 100 microns (um).

The TIM 160 between the IHS 150 and the heat sink 170 tends to migrateoutwards over the edge of the IHS 150 when the integrated circuitpackage 100 undergoes reliability testing such as shock, vibration, hightemperature bake, and temperature cycling. The top side IHS 150 warpageexacerbates this migration, which in turn, causes empty voids 190 or airpockets between the IHS 150 and the heat sink 170. These voids 190 cancause severe degradation in the cooling capability of the heat sink 170,because with the formation of these voids 190, there is less surfacearea to transfer heat generated from the integrated circuit die 140through the IHS 150 to the heat sink 170. For example, the degradationin the cooling capability can be on the order of 0.04 degrees Centigradeper Watt, and for a 125 Watt integrated circuit device, this degradationtranslates to an increase of 5 degrees Centigrade in the operatingtemperature of the integrated circuit device. Consequently, this leadsto slower performance of the integrated circuit device and shortens thelongevity of the integrated circuit device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross section view of a prior art integratedcircuit package.

FIG. 2 illustrates a cross section view of a prior art integratedcircuit package assembly with a socket and a heat sink.

FIG. 3 illustrates a cross section view of an integrated circuit packageaccording to an embodiment of the present invention.

FIG. 4 illustrates a cross section view of an integrated circuit packageassembly with a socket and a heat sink according to an embodiment of thepresent invention.

FIG. 5 illustrates an integrated heat spreader according to oneembodiment of the present invention.

FIG. 6 illustrates an integrated heat spreader according to anotherembodiment of the present invention.

FIG. 7 illustrates an integrated heat spreader according to a furtherembodiment of the present invention.

FIG. 8 illustrates a computing device according to an embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description sets forth numerous specific details such asexamples of specific systems, components, methods, and so forth, inorder to provide a good understanding of several embodiments of thepresent invention. It will be apparent to one skilled in the art,however, that at least some embodiments of the present invention may bepracticed without these specific details. In other instances, well-knowncomponents or methods are not described in detail or are presented in asimple block diagram format in order to avoid unnecessarily obscuringthe present invention. Thus, the specific details set forth are merelyexemplary. Particular implementations may vary from these exemplarydetails and still be contemplated to be within the spirit and scope ofthe present invention.

Reference in the description to “one embodiment” or “an embodiment”means that a particular feature, structure, or characteristic describedin connection with the embodiment is included in at least one embodimentof the invention. The appearances of the phrase “in one embodiment” invarious places in the specification do not necessarily all refer to thesame embodiment. It is to be understood that the various embodiments ofthe invention, although different, are not necessarily mutuallyexclusive. Furthermore, the terms “above,” “under,” and “between” and“on” as used herein refer to a relative position of one component withrespect to other components. As such, for example, one component aboveor under another component may be directly in contact with the othercomponent or may have one or more intervening components.

Embodiments of the present invention disclose an improved package levelheat dissipation device such as an integrated heat spreader (IHS) with atop side ridged perimeter to minimize thermal interface material (TIM)degradation in an integrated circuit package. The top side ridgedperimeter of the IHS prevents TIM from flowing out from between the IHSand a package level heat dissipation device (e.g., a heat sink). Thisensures good thermal contact between the IHS and the heat sink even whenthe IHS is warped due to forces exerted on the IHS by the packageassembly. In an embodiment, a ridge is formed along the perimeter of theIHS to compensate for a convex warpage on the top surface of the IHS. Inother embodiments, addition ridges are formed on the interior of the topside of the package level heat dissipation device to compensate forother types of warpage. In an alternative embodiment, a ridge is formedalong a portion of the perimeter of the package level heat dissipationdevice.

In accordance to one embodiment of the present invention, FIG. 5illustrates a perspective view of an integrated heat spreader (IHS) 500.The IHS 500 is a planar piece of material with good heat conductivityproperties. In an embodiment, the IHS 500 may be made of copper ordiamond. The IHS 500 has a top side 510 and a bottom side 520. The topside 510 is configured to be thermally coupled to a component level heatdissipation device (e.g., a heat sink) through an interposed thermalinterface material (TIM). The bottom side 520 is configured to bethermally coupled to an integrated circuit die through another layer ofTIM. In an embodiment, the bottom side 520 has a cavity that isconfigured to sit above an integrated circuit die. Before beingassembled into an integrated circuit package, the surface of the cavityon the bottom side 520 and the interior portion 550 of the top side 510are substantially flat. In some embodiments, the IHS 500 may have a step(not shown) that extends laterally outward from the sidewalls of theouter edge of the perimeter of the bottom side 520. This step is used asloading points on the integrated circuit package where the integratedcircuit package can be pushed down into a socket by an independentloading mechanism (ILM).

In one embodiment, the perimeter of the top side 510 is elevatedrelative to the interior portion 550 of the top side 510 to form a ridge552 on the perimeter. The perimeter of the IHS 500 is elevated to aheight that is less than the eventual compressed thickness of the TIMdisposed on top of the IHS 500. The compressed thickness of the TIM isthe final thickness of the TIM after an assembled integrated circuitpackage is loaded into a socket and a heat sink is installed on top ofthe IHS 500. Depending on the height of the compressed TIM afterassembly, in one embodiment, the perimeter of the IHS 500 may beelevated to form a ridge 552 having a maximum height of less than 10mils above the interior portion 550 of the top side 510 of the IHS 500.In other embodiments, the perimeter of the IHS 500 may be elevated toform a ridge 552 having a maximum height of less than 2 mils above theinterior portion 550 of the top side 510 of the IHS 500. In furtherembodiments, the maximum height of the ridge 552 extending above theinterior portion 550 of the top side 510 of the IHS 500 is within arange of 50% to 75% of the thickness of the compressed TIM. While it ispreferable for the ridge 552 to have the same height along the perimeterof the IHS 500 to compensate for an evenly warped top side 510, inalternative embodiments, the height of the ridge 552 may vary along theperimeter of the IHS 500, for example, to compensate for a warpage thatis more severe along one edge.

According to embodiments of the present invention, the ridge 552 retainsthe TIM that is disposed on top of the IHS 500 and provides a barrier toprevent the TIM from migrating over an edge of the IHS 500 when the IHS500 is under warpage. In an embodiment, the ridge 552 is continuousalong the perimeter of the top side 510 with no openings or groovesalong the ridge 552. Although ideally, the ridge 552 is continuous alongthe perimeter of the top side 510, in an alternative embodiment, theridge 552 may have breaks, notches, or grooves and still be able toretain or slow the migration of TIM. For example, the ridge 552 may beformed on a substantial portion of the perimeter such as 50%, 60%, 70%,80%, or 90% of the perimeter. Depending on how the IHS 500 is warped,the breaks, notches, or grooves can be used to compensate for thedifferent patterns of warpage. Furthermore, the breaks, notches, orgrooves can also be used for alignment purposes during assembly of theintegrated circuit package.

In one embodiment, the ridge 552 and the IHS 500 is a one-piececonstruction. That is, the ridge 552 is integrated into the IHS 500 andis formed as part of the IHS 500. For example, the ridge 552 can beformed by elevating the perimeter of the IHS 500 by stamping, machining,or die casting the IHS material. In another embodiment, the ridge 552can be formed by bonding or welding one or more separate pieces of IHSmaterial on top of the perimeter of a flat piece of IHS material. Whileit is preferable for better heat transfer to use the same type ofmaterial for the ridge 552 and the rest of the IHS 500, in a furtherembodiment where the ridge 552 is bonded to the IHS 500, the ridge 552can be made of a different type of heat conductive material than therest of the IHS 500, for example, to save material costs.

In an embodiment, the interior portion 550 of the top side 510 can be asquare cavity to compensate for a convex warpage on the top side 510 ofthe IHS 500. Alternatively, the interior portion 550 can be arectangular cavity or other geometric shapes to match the shape of theintegrated circuit die. In one embodiment, the interior portion 550 islarger than the footprint of the integrated circuit die such that theridge 552 does not sit above the integrated circuit die when the IHS 500is thermally coupled to the integrated circuit die. In anotherembodiment, the interior portion 550 can be smaller than the footprintof the integrated circuit die such that a portion of the ridge 552 sitsabove a portion of the integrated circuit die.

The dimension of each side of the interior portion 550 may have the sameproportion relative to the respective dimension of the integratedcircuit die. For example, if the interior portion 550 is larger than thefootprint of the integrated circuit die, the length of each side of theinterior portion 550 can be 1.1, 1.25, or 1.5 times the length of therespective side of the integrated circuit die. If the interior portion550 is smaller than the footprint of the integrated circuit die, thelength of each side of the interior portion 550 can be 0.9, 0.8, or 0.75times the length of the respective side of the integrated circuit die.Alternatively, only the dimensions along one axis (e.g., along twoparallel sides) of the interior portion 550 may have the same proportionrelative to the respective dimensions of the integrated circuit die. Forexample, in an embodiment, the length of the two sides of the interiorportion 550 along an x-axis can be 1.1 times the respective dimensionsof the integrated circuit die, whereas the length of the two sides ofthe interior portion 550 along an x-axis can be 0.9 times the respectivedimensions of the integrated circuit die.

The corners along the plane of the interior portion 550 may havesubstantially straight edges or have curved or rounded edges. In oneembodiment, the sidewall on the interior side of the ridge 552 issubstantially vertical and forms an approximate right angle with theinterior portion 550. In other embodiments, the sidewall on the interiorside of the ridge 552 can have a slopped, curved, or curvilinearprofile, and can form an obtuse angle with the interior portion 550.Similarly, the sidewall on the exterior side of the ridge 552 can alsobe substantially vertical or can have a slopped, curved, or curvilinearprofile.

FIG. 3 illustrates a cross section view of an exemplary integratedcircuit package 300 with an improved IHS 350 with a top side ridgedperimeter to retain TIM on the top side of the IHS 350 when the IHS 350is under warpage. In one embodiment, the integrated circuit package 300includes a package substrate 330, an integrated circuit die 340electrically coupled to the package substrate 330, and a IHS 350disposed above the integrated circuit die 340. In some embodiments, theintegrated circuit die 340 is electrically coupled to the packagesubstrate 330 through solder bumps such as C4 solder bumps.

The top side of the package level heat dissipation device 350 has aridge 352 that is formed on the perimeter of the top side as describedabove. In an embodiment, the ridge 352 is integrated into the IHS 350and is formed as part of the IHS 350, and is composed of the samematerial as the rest of the IHS 350. The purpose of the ridge 352 is toform a shallow cavity to retain a layer of TIM on the top side of theIHS 350. In an exemplary embodiment, the IHS 350 can be the IHS 500 ofFIG. 5 described above.

The bottom side of the IHS 350 is thermally coupled to the integratedcircuit die 340. In one embodiment, the IHS 350 is disposed above andthermally coupled to the integrated circuit die 340 through a layer ofTIM 341 on the bottom side of the IHS 350. In some embodiments, the IHS350 is attached, for example, with an epoxy, to the package substrate330 to form a cavity with the package substrate 330 to encapsulate theintegrated circuit die 340.

FIG. 4 illustrates a cross section view of the integrated circuitpackage assembly 400 after the integrated circuit package 300 has beeninserted and secured into a socket 320 and after a component level heatdissipation device has been attached to the integrated circuit package300 according to one embodiment of the present invention. In anexemplary embodiment, the component level heat dissipation device is aheat sink 370 as shown in FIG. 4. In alternative embodiments, thecomponent level heat dissipation device can be a heat pipe or other heatdissipation devices.

The integrated circuit package 300 is placed into the socket 320 beforethe heat sink 370 is attached to the top of the IHS 350. In anembodiment, the socket 320 is mounted onto the printed circuit board(PCB) 310 through solder balls 321. In the integrated circuit packageassembly 400, the integrated circuit package 300 is secured into thesocket 320 with an ILM. The ILM has a retention frame 382 that ismounted onto the printed circuit board (PCB) 310 and surrounds thesocket 320. The ILM has a load plate 381 that is hinged to the retentionframe 382. The load plate 381 is a bracket that, when in a closedposition, covers a portion of the step 354 along the edges of the IHS350 while exposing the top surface of the IHS 350. After the integratedcircuit package 300 has been placed into the socket 320, the load plate381 is rotated into the closed position. A load lever pivoted to theretention frame 382 is engaged to forcibly press the load plate 381 downagainst the integrated circuit package 300, applying a downward force atthe step 354 along the edges of the IHS 350 to secure the integratedcircuit package 300 into the socket 320. The force of the ILM pushingdown on the step 354 of the IHS 350 can exceed 100 pounds (lbs.) offorce. The load lever is then locked into place to retain the load plate381 in the closed position and to ensure proper electrical contactbetween contact points in the socket 320 and the solder balls 331 of thepackage substrate 330.

Before the heat sink 370 is installed, a thermal interface material(TIM) 360 is dispensed from a storage tube into the cavity formed by theridge 352 on the top surface of the IHS 350. The TIM 360 is a paste-likesubstance such as a thixotropic paste, a carbon black paste, or afluidic paste, and can be a phase change material or a thermal greasematerial that has a tendency to flow. The heat sink 370 is then placedover the TIM 360 and on top of the IHS 350. The heat sink 370 is thenpressed down against the IHS 350. As the heat sink 370 pushes down onthe TIM 360 on top of the IHS 350, the TIM 360 is compressed anddistributed across the top surface of the IHS 350 and across the bottomsurface of the heat sink 370, filling the cavity formed by the ridge 352and up over the top of the ridge 352. In an embodiment, the initialthickness of the TIM 360 may be around 10 mils, and the final compressedthickness of the TIM 360 may be around 2 mils. Connectors 383 positionedat heat sink attachment points over the edges of the integrated circuitpackage 300 are used to secure the heat sink 370 to the retention frame382 of the ILM and/or to the PCB 310. When the connectors 383 aretightened to secure the heat sink 370, an additional 50 lbs. of forcecan be asserted along the edges of the IHS 350.

As a result of the downward forces from the ILM and the heat sink 370that can total over 150 lbs. of force being applied to the edges of theIHS 350, the top side of the IHS 350 is warped with a convex curvature.In an embodiment, the warpage can be 100 um, 130 um, 150 um, or even 180um or above. Despite this warpage, as illustrated in FIG. 4, the ridge352 of the IHS 350 is sized to provide a barrier to retain the TIM 360and to prevent the TIM 360 from migrating over an edge of the IHS 350.Because the TIM 360 must be in contact with both the IHS 350 and theheat sink 370 to promote heat transfer, the height of the ridge 353 issized less than the compressed thickness of the TIM 360 such that whenthe TIM 360 is compressed during package assembly, the TIM 360 flows upand over the ridge 352 as shown. Otherwise, if the ridge 352 is toohigh, a large amount of the TIM 360 would sit in the cavity formed bythe ridge 352 and the top surface of the IHS 350 without making contactwith the heat sink 370. By forming the ridge 352 at a height 353 that isless than the thickness of the compressed TIM 360, the ridge 352 servesas a dam to prevent the TIM 360 material from flowing out from betweenthe IHS 350 and the heat sink 370, while keeping the TIM 360 in contactwith both the top side of the IHS 350 and in contact with the bottomside of the heat sink 370. As a result, TIM voids 190 such as thoseshown in FIG. 2 can be reduced or prevented all together to ensureproper thermal dissipation of the integrated circuit device duringoperation even when there is warpage on the top side of the IHS 350.

While the warpage of the IHS 350 as shown in FIG. 4 is convex, thegeometry and the amount of warpage depends on factors such as the sizeand thickness of the IHS 350, the size of the integrated circuit die340, the size of the package substrate 330, the number of layers in thepackage substrate 330, the amount of load applied to secure theintegrated circuit package 300 into the socket 320, the amount of loadapplied to secure the heat sink 370 to the PCB 310, and the locations onthe integrated circuit package 300 that these loads are applied to.Because of the numerous factors that can affect the warpage of the IHS350, the warpage can take on any number of different geometries. Tocompensate for these different geometries, embodiments of the presentinvention can have the ridges or elevated portions on the top side ofthe IHS patterned accordingly to safeguard against TIM migrationresulting from the different types and patterns of warpage.

For example, FIG. 6 illustrates another embodiment of an IHS 600 inaccordance with the present invention. In this embodiment, in additionto an elevated perimeter ridge 652, the top side 610 of the IHS 600 hasone or more elevated or raised sections in the interior portion of thetop side 610 to form interior ridges 662 to create a plurality ofrectangular cavities 672. This configuration minimizes TIM degradationwhen the top side IHS warpage is convex along an axis that isperpendicular to the elevated interior ridges 662 in the interiorportion of the top side 610. As shown, the horizontal axis of the figureis perpendicular to the elevated interior ridges 662 in the interiorportion of the IHS 600. Hence, as shown, this configuration is used tominimize TIM degradation for a top side IHS warpage that is convex alongthe horizontal axis of the figure. In one embodiment, the height of theinterior ridges 662 may be the same as the height of the perimeter ridge652. In other embodiments, the height of the interior ridges 662 may belower than the height of the perimeter ridge 652 to compensate for moreextreme convex warpage.

FIG. 7 illustrates a further embodiment of an IHS 700 in accordance withthe present invention. In addition to an elevated perimeter ridge 752,the top side 710 of the IHS 700 has an elevated or raised circularsection at the center of the top side 710 to create an island ridge 762.Instead of having a square or rectangular shape, the interior sidewallof the elevated perimeter ridge 752 is circular. Hence, the interiorisland ridge 762 together with the elevated perimeter ridge 752 forms atorrid or ring shape cavity 772. This exemplary configuration minimizesTIM degradation when the top side IHS warpage is concave. In oneembodiment, the height of the interior island ridge 762 may be the sameas the height of the perimeter ridge 752. In other embodiments, theheight of interior island ridge 762 may be higher than the height of theperimeter ridge 752 to compensate for more extreme concave warpage.

Similar to the perimeter ridge, the interior ridges according toembodiments of the present invention may have a consistent height or mayhave a height that varies such that a maximum height of the interiorridges is less than the compressed thickness of the TIM disposed on topof the IHS to allow the TIM to flow up and over the top of the interiorridges. Furthermore, the interior ridges may also have addition breaks,notches, or grooves or form different patterns depending on the geometryof the warpage of the IHS. The interior ridges can be formed in the sameway as the perimeter ridge, and can be integrated as part of the IHS orbe bonded to a flat piece of IHS material as described with reference tothe IHS 500 of FIG. 5.

FIG. 8 illustrates a computing device 1000 in accordance with oneimplementation of the invention. The computing device 1000 houses aboard 1002. The board 1002 may include a number of components, includingbut not limited to a processor 1004 and at least one communication chip1006. The processor 1004 is physically and electrically coupled to theboard 1002. In some implementations the at least one communication chip1006 is also physically and electrically coupled to the board 1002. Infurther implementations, the communication chip 1006 is part of theprocessor 1004.

Depending on its applications, computing device 1000 may include othercomponents that may or may not be physically and electrically coupled tothe board 1002. These other components include, but are not limited to,volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flashmemory, a graphics processor, a digital signal processor, a cryptoprocessor, a chipset, an antenna, a display, a touchscreen display, atouchscreen controller, a battery, an audio codec, a video codec, apower amplifier, a global positioning system (GPS) device, a compass, anaccelerometer, a gyroscope, a speaker, a camera, and a mass storagedevice (such as hard disk drive, compact disk (CD), digital versatiledisk (DVD), and so forth).

The communication chip 1006 enables wireless communications for thetransfer of data to and from the computing device 1000. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a non-solid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not. The communication chip 1006 may implementany of a number of wireless standards or protocols, including but notlimited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE,GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well asany other wireless protocols that are designated as 3G, 4G, 5G, andbeyond. The computing device 1000 may include a plurality ofcommunication chips 1006. For instance, a first communication chip 1006may be dedicated to shorter range wireless communications such as Wi-Fiand Bluetooth and a second communication chip 1006 may be dedicated tolonger range wireless communications such as GPS, EDGE, GPRS, CDMA,WiMAX, LTE, Ev-DO, and others.

The processor 1004 of the computing device 1000 includes an integratedcircuit die packaged within the processor 1004. In some implementationsof the invention, the integrated circuit die of the processor 1004 ispackaged in an integrated circuit package that includes a ridgedintegrated heat spreader in accordance with implementations of theinvention. The term “processor” may refer to any device or portion of adevice that processes electronic data from registers and/or memory totransform that electronic data into other electronic data that may bestored in registers and/or memory.

The communication chip 1006 also includes an integrated circuit diepackaged within the communication chip 1006. In accordance with anotherimplementation of the invention, the integrated circuit die of thecommunication chip 1006 is packaged in an integrated circuit packagethat includes a ridged integrated heat spreader in accordance withimplementations of the invention

In further implementations, another component housed within thecomputing device 1000 may contain an integrated circuit die that ispackaged in an integrated circuit package that includes a ridgedintegrated heat spreader in accordance with implementations of theinvention

In various implementations, the computing device 1000 may be a laptop, anetbook, a notebook, an ultrabook, a smartphone, a tablet, a personaldigital assistant (PDA), an ultra mobile PC, a mobile phone, a desktopcomputer, a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. In further implementations, the computingdevice 1000 may be any other electronic device that processes data.

The foregoing description of the preferred embodiments is provided toenable any person skilled in the art to make or use the presentinvention. Various modifications to these embodiments are possible, andthe generic principles presented herein may be applied to otherembodiments as well. As such, the present invention is not intended tobe limited to the embodiments shown above but rather is to be accordedthe widest scope consistent with the principles and novel featuresdisclosed in any fashion herein.

The invention claimed is:
 1. An integrated circuit package, comprising:a package substrate; an integrated circuit die electrically coupled tothe package substrate; and an integrated heat spreader (IHS) disposedabove the integrated circuit die, wherein the IHS comprises a bottomside that thermally couples to the integrated circuit die, and a topside comprising a ridged perimeter and an interior ridge within theridged perimeter.
 2. The integrated circuit package of claim 1, whereinthe interior ridge comprises a raised circular section at a center ofthe top side to form a ring shape cavity with the ridged perimeter. 3.The integrated circuit package of claim 1, wherein a height of theridged perimeter extending above an interior portion of the top side ofthe package level heat dissipation device is less than 2 mils.
 4. Theintegrated circuit package of claim 1, wherein the ridged perimeter isformed by one of stamping, machining, or die casting.
 5. The integratedcircuit package of claim 1, wherein the IHS is made of a materialselected from the group consisting of copper and diamond.
 6. Anintegrated circuit package assembly, comprising: a package substrate; anintegrated circuit die electrically coupled to the package substrate;and a integrated heat spreader (IHS) disposed above the integratedcircuit die, wherein the IHS comprises a bottom side thermally coupledto the integrated circuit die, and a top side comprising ridgedperimeter and an interior ridge within the ridged perimeter; a thermalinterface material (TIM) disposed above the IHS; and a component levelheat dissipation device disposed above the TIM.
 7. The integratedcircuit package assembly of claim 6, wherein the IHS has a warpage onthe top side, and the ridged perimeter provides a barrier to prevent theTIM from flowing over an edge of the IHS.
 8. The integrated circuitpackage assembly of claim 7, wherein the warpage is convex on the topside of the IHS.
 9. The integrated circuit package assembly of claim 7,wherein the interior ridge comprises a raised circular section at acenter of the top side to form a ring shape cavity with the ridgedperimeter ridge.
 10. The integrated circuit package assembly of claim 9,wherein the warpage is concave on the top side of the IHS.
 11. Theintegrated circuit package assembly of claim 6, wherein the TIM isselected from the group consisting of a phase change material and athermal grease material.
 12. The integrated circuit package assembly ofclaim 6, wherein a height of the ridged perimeter extending above aninterior portion of the top side of the IHS is less than a thickness ofthe TIM.
 13. The integrated circuit package assembly of claim 12,wherein the thickness of the TIM is in a range of 2 mils to 10 mils. 14.The integrated circuit package assembly of claim 12, wherein the heightof the ridged perimeter extending above the interior portion of the topside of the IHS is in a range of 50% to 75% of the thickness of the TIM.15. The integrated circuit package assembly of claim 6, wherein thecomponent level heat dissipation device is a heat sink.
 16. Theintegrated circuit package assembly of claim 6, wherein the integratedcircuit die is a microprocessor die.
 17. An integrated circuit package,comprising: a package substrate; an integrated circuit die electricallycoupled to the package substrate; and an integrated heat spreader (IHS)disposed above the integrated circuit die, wherein the IHS comprises abottom side that thermally couples to the integrated circuit die, and atop side comprising a ridge formed on at least a portion of a perimeterof the top side, wherein the top side of the IHS further comprises araised circular section at a center of the top side to form a ring shapecavity with the ridge on the perimeter of the top side.
 18. Anintegrated circuit package assembly, comprising: a package substrate; anintegrated circuit die electrically coupled to the package substrate;and a integrated heat spreader (IHS) disposed above the integratedcircuit die, wherein the IHS comprises a bottom side thermally coupledto the integrated circuit die, and a top side comprising a ridge formedon at least a portion of a perimeter of the top side, wherein the topside of the IHS further comprises a raised circular section at a centerof the top side to form a ring shape cavity with the ridge on theperimeter of the top side; a thermal interface material (TIM) disposedabove the IHS; and a component level heat dissipation device disposedabove the TIM.